European projects

QUEFORMAL - Quantum Engineering for Machine Learning

H2020-FETOPEN-2018-2019-2020-01 Start date  1 Jan 2019


We propose the radical vision of a new integrated circuit technology for machine learning where low-voltage field-effect transistors and non-volatile memories are integrated next to each other exploiting quantum engineering of heterostructures of two-dimensional materials (2DMs), i.e. the atom-by-atom design and fabrication of devices which combine vertical and lateral heterostructures (VH and LH, respectively) of 2DMs.

WASP - Wearable Applications enabled by electronics Systems on Paper

H2020-ICT-2018-2 Start date 1 Jan 2019

The WASP project aims at bringing the much-needed step change in flexible and wearable electronics by developing a new industrially driven enabling printing technology for the definition of electronic devices and circuits on paper, a flexible and foldable substrate, which is low cost, disposable, biodegradable, easily obtainable in nature and compatible with high speed roll-to-roll processes.

VOSTARS - Video and Optical See Through Augmented Reality surgical Systems

H2020-ICT-2016-1 Start Date 1 December 2016

The idea of integrating the surgeon’s perceptive efficiency with the aid of new augmented reality (AR) visualization modalities has become a dominant topic of academic and industrial research in the medical domain since the 90’s. AR technology appeared to represent a significant development in the context of image-guided surgery (IGS).

R3 - PowerUp

ECSEL-2016-2 Start Date 1 Nov 2017

Smart power ICs are key enabling components for applications in which Europe is playing a leading role: from mid-power automotive, to industrial power, battery management systems for HEV, FEV and electric bikes, domotics, LED lighting for both indoor and outdoor, computer and industrial peripherals.

R2POWER300 - Preparing RZ extension to 300mm for BCD Smart Power

ECSEL-2014-2 Start Date July 1, 2015

R2POWER300 is committed to challenge the following objectives:

  • Development and manufacturing of a multi-KET Pilot Line (i.e. Nanoelectronics, Nanotechnology, Advanced Manufacturing;
  • Energy Efficiency and CO2 Reduction megatrends.

The strategy of this Pilot Line is based on two main pillars:

HIPEAC - High Performance and Embedded Architecture

H2020-ICT- 2017-1 Start Date December 1, 2017

HiPEAC is a coordination and support action (CSA) that aims to structure and connect the European academic and industrial research and innovation communities in computing systems (i) by increasing the industrial membership, (ii) by integrating the European innovation community, (iii) by organising activities to connect the research and innovation