The WASP project aims at bringing the much-needed step change in flexible and wearable electronics by developing a new industrially driven enabling printing technology for the definition of electronic devices and circuits on paper, a flexible and foldable substrate, which is low cost, disposable, biodegradable, easily obtainable in nature and compatible with high speed roll-to-roll processes.
Smart power ICs are key enabling components for applications in which Europe is playing a leading role: from mid-power automotive, to industrial power, battery management systems for HEV, FEV and electric bikes, domotics, LED lighting for both indoor and outdoor, computer and industrial peripherals.
The European Processor Initiative (EPI) gets together 23 partners from 10 European countries, with the aim to bring to the market a low power microprocessor.
The EPI SGA1 project will be the first phase of the European Processor Initiative FPA, whose aim is to design and implement a roadmap for a new family of low-power European processors for extreme scale computing, high-performance Big-Data and a range of emerging applications.
Il corso è stato attivato nell'ambito della Laurea Magistrale in Computer Engineering per fornire agli studenti le conoscenze fondamentali per padroneggiare i linguaggi di programmazione quantistica